UV Adhesive for Electronic Assembly
| Grade | Cure Mechanism | Elongation (%) | Substrates | Viscosity at 25°C (cps) | Shore Hardness | Application |
| 8023 | UV, Visible | 0.9 | metals, plastics, ferrite | 17,000 – 20,000 | 45D | Using the spherical top coating method, it is suitable for high-viscosity encapsulants in specific areas of precision electronic assembly. |
| 8325 | UV, Visible | 0.72 | metals, plastics, ferrite | 600 -800 | 55D | Used for connectors, thermal switches and thermal protection. |
| 863 | UV, Visible | 0.12 | metals, ceramic,glass-filled,epoxy | 150 - 200 | 85D | The curing speed is fast. It is suitable for tough and smooth encapsulation coatings, and has excellent adhesion to circuit boards and masks. |
| 8527 | UV, Visible | 0.48 | metals, plastics, glass | 40,000 – 60,000 | 52D | Suitable for the connection, packaging and sealing of electronic components. |
| Grade | Substrates | Viscosity at 25°C (cps) | Application |
| 8023 | metals, plastics, ferrite | 17,000 – 20,000 | Using the spherical top coating method, it is suitable for high-viscosity encapsulants in specific areas of precision electronic assembly. |
| 8325 | metals, plastics, ferrite | 600 -800 | Used for connectors, thermal switches and thermal protection. |
| 863 | metals, ceramic,glass-filled,epoxy | 150 - 200 | The curing speed is fast. It is suitable for tough and smooth encapsulation coatings, and has excellent adhesion to circuit boards and masks. |
| 8527 | metals, plastics, glass | 40,000 – 60,000 | Suitable for the connection, packaging and sealing of electronic components. |